At the Samsung Foundry Forum 2022, the Korean semiconductor maker announced that it is aiming for mass production in 2nm technology by 2025 and 1.4nm by 2027. Samsung Foundry also plans to triple its installed production capacity for advanced nodes by 2027. Non-mobile applications, including HPC and automotive, are expected to exceed 50% of its foundry portfolio by 2027, the Korean foundry claims .
During the Samsung Foundry Forum 2022, the Korean manufacturer announced a strengthened business strategy for its foundry business with the introduction of advanced technologies.
” Targeting technology development up to 1.4nm and specialized foundry platforms for each application, as well as stable supply through constant investment are all part of Samsung’s strategies to ensure customer confidence and support their hit. Realizing each customer’s innovations with our partners is at the heart of our foundry service said Si-young Choi, President and Head of Foundry Business at Samsung Electronics.
With significant market growth in high performance computing (HPC), artificial intelligence (AI), 5/6G connectivity and automotive applications, the demand for advanced semiconductors has increased dramatically, making innovation in technology semiconductor processes critical to the commercial success of foundry customers. To that end, Samsung has underscored its commitment to bring its most advanced processing technology, -1.4 nanometers, to mass production as soon as 2027.
As the company has introduced its 3nm process technology into mass production, Samsung will continue to improve the technology based on the gate-all-around (GAA) architecture and plans to introduce the 2nm process in 2025. and 1.4nm process in 2027. Regarding packaging, Samsung is also accelerating the development of 2.5D/3D heterogeneous integration packaging technology to provide a complete system solution in foundry services. Its X-Cube 3D packaging technology with micro-bump interconnection will be ready for mass production in 2024, and the bumpless X-Cube will be available in 2026.
The proportion of HPC, automotive and 5G will exceed 50% of its foundry revenue by 2027
For its foundry services, Samsung plans to target high-performance, low-power semiconductor markets such as HPC, automotive, 5G and Internet of Things (IoT). To better meet customer needs, custom and bespoke process nodes were introduced at this year’s Foundry Forum. Samsung will enhance its GAA-based 3nm process support for HPC and mobile, while further diversifying the specialized 4nm process for HPC and automotive applications. For automotive customers in particular, Samsung currently provides embedded non-volatile memory (eNVM) solutions based on 28nm technology. To support automotive-grade reliability, the company plans to further expand process nodes by launching 14nm eNVM solutions in 2024 and adding 8nm eNVM in the future. Samsung has also been volume-producing RF circuits in 8nm technology after 14nm RF technology, and 5nm technology for RF circuits is currently under development.
To meet customer needs in a timely manner, Samsung plans to more than triple its production capacity for advanced nodes by 2027 compared to this year. Samsung’s manufacturing lines for its foundry services are currently spread over five sites: Giheung, Hwaseong and Pyeongtaek in Korea; and Austin and Taylor (under construction) in the United States. At the Forum, Samsung detailed its “Shell-First” strategy for investing in new production capacity, building clean rooms first, regardless of market conditions. With clean rooms readily available, manufacturing equipment can be installed later and flexibly configured as needed, based on future demand. With this investment strategy, Samsung believes it will be able to better meet customer demands.
New foundry technologies and strategies with ecosystem partners will be introduced in areas such as electronic design automation (CAD), IP blocks, outsourced semiconductor assembly and test (OSAT) , etc. In 2022, Samsung offers more than 4000 IP blocks with 56 partners, and also cooperates with 22 CAD partners. The founder also offers cloud services with nine partners and packaging services with 10 partners.